2008 IITC Organizing Committee

2008 IEEE International Interconnect Technology Conference

2009 IITC Organizing Committee

EXECUTIVE COMMITTEE

Conference General Co-chairs:
Young-Chang Joo, Seoul National University
J.D. Luttmer
John MacNeil, Aviza Technology

OFFICERS AND MEMBERS

North America Program Chair: Mike Shapiro, IBM
North America Program Co-chair: John Iacoponi, AMD
Asia Program Chair: Shin-Puu Jeng, TSMC
Asia Program Co-chair:Takeshi Furusawa, Renesas Technology Corp.
Europe Program Chair:Rudi Cartuyvels, IMEC
Europe Program Co-chair:Ehrenfried Zschech, AMD
Publicity Chair:Hiroshi Toyoda, Toshiba Corp.
Publicity Co-Chair:Michael Armacost, Applied Materials
Short Course Chair:Toshiaki Hasegawa, Sony Corp.
Short Course Co-chair:Nagaraj NS, Texas Instruments
Treasurer:John Iacoponi, AMD
Supplier Relations:Didier Louis, CEA/LETI
Supplier Relations:Dorel Toma, Tokyo Electron U.S. Holdings

PROGRAM COMMITTEE

North America

Chair: Mike Shapiro, IBM
Co-Chair:John Iacoponi, AMD
Michael Armacost, Applied Materials
Maureen Brongo, Skyworks Solutions
Robin Cheung, Unity Semiconductor Corp.
Girish Dixit, Novellus
Pawan Kapur, Stanford University
Scott List, SRC
Toh-Ming Lu, RPI
James Meindl, Georgia Institute of Technology
Nagaraj NS, Texas Instruments
Hector Sanchez, Freescale Semiconductor
Dorel Toma, Tokyo Electron U.S. Holdings

Asia

Chair: Shin-Puu Jeng, TSMC
Co-Chair:Takeshi Furusawa, Renesas Technology Corp.
Chee Lip Gan, nanyang Technological University
Toshiaki Hasegawa, Sony Corp.
Climbing Huang, UMC
Noh-Jung Kwak, Hynix Semiconductor
Jeong-gun Lee, MagnaChip Semiconductor
Nae-In Lee, Samsung Electronics Co., Ltd.
Chien-Neng Liao, National Tsing-Hua University
Tomoji Nakamura, Fujitsu Labs., Ltd.
Shinichi Ogawa, SELETE
Hyn-Chul Sohn, Yonsei University
Kenichi Takeda, Hitachi Ltd.
Tetsu Tanaka, Tohoku University
Hiroshi Toyoda, Toshiba Corp.
Osamu Yamazaki, Sharp Corp.

Europe

Chair:Rudi Cartuyvels, IMEC
Co-Chair:Ehrenfried Zschech, AMD
Vicent Arnal, STMicroelectronics
Hans-Joachim Barth, Infineon Technologies
Johann Bartha, Technical University of Dresden
Myriam Buchbinder, Tower Semiconductor
Didier Louis, CEA/LETI
Ivo Raaijimakers, ASM International nv
Mikko Ritala, University of Helsinki
Joost Waeterloos, The Dow Chemical Company
Alexandra Wirth, BASF Electronic Material

Past General Co-chairs:
1998-2000: Robert Havemann, Novellus, Karen Maex, IMEC, Takamaro Kikkawa, Hiroshima University
2001: Rich Liu, Macronix, Genda Hu, TSMC, Hans-Joachim Barth, Infineon Technologies
2002: Robert Geffken, IBM, Nobuyoshi Kobayashi, ASM Japan K.K. and Mehdi Moussavi, AMAT
2003: Krishna Saraswat, Stanford University, Nobuo Hayasaka, Toshiba Corporation and Johann Bartha, Technical University of Dresden
2004: Betsy Weitzman, International SEMATECH, Douglas C.H. Yu, TSMC and Joaquin Torres, STMicroelectronics
2005: Duane Boning, Massachusetts Institute of Technology, Shinichi Ogawa, SELETE, Dirk Gravesteijn, Philips Research
2006: Christopher Case, The Linde Group, Jeong-gun Lee, MagnaChip Semiconductor Inc., Didier Louis, CEA/LETI
2007: Harold Hosack, SRC, Calvin Hsueh, TSMC, Joost Waeterloos, The Dow Chemical Company