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Committees

 
 

2009 COMMITTEES

Executive Committee
CMOS Devices and Technology Committee
Characterization, Reliability and Yield Committee
Displays, Sensors and MEMs Committee
Memory Technology Committee
Modeling and Simulation Committee
Process Technology Committee
Quantum, Power and Compound Semiconductor Devices Committee
Solid State and Nanoelectronic Devices Committee

EXECUTIVE COMMITTEE

General Chair
Vivek Subramanian
University of California Berkeley
Berkeley,CA

Technical Program Chair
Meikei Ieong
TSMC
Hsinchu, Taiwan, ROC

Technical Program Vice Chair
Kazunari Ishimaru
Toshiba America Electronic Components, Inc.
Hopewell Junction, NY

Publications Chair
Tahir Ghani
Intel
Hillsboro, OR

Short Course Chair
Roland Thewes
Qimonda AG
Neubiberg , Germany

Short Course Vice Chair
Howard C.-H. Wang
TSMC
Hsinchu, Taiwan ROC

Publicity Chair
Veena Misra
North Carolina State University
Raleigh, NC

Publicity Vice Chair
John Suehle
NIST
Gaithersburg, MD

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Emerging Technologies Chair
Toshiro Hiramoto
University of Tokyo
Tokyo, Japan

Asian Arrangements Co-Chair
Masami Hane
IBM at Albany Nanotech
Albany, NY

Asian Arrangements Co-Chair
Albert Chin
National Chiao-Tung University
Hsinchu, Taiwan ROC

European Arrangements Co-Chair
Frederic Boeuf
STMicroelectronics
Crolles, France

European Arrangements Co-Chair
Giovanni Ghione
Politecnico di Torino
Torino, Italy

Conference Planners
Phyllis Mahoney
Widerkehr and Associates
Montgomery Village, MD

Corin Ford
Widerkehr and Associates
Montgomery Village, MD

CMOS DEVICES AND TECHNOLOGY COMMITTEE

Kiyotaka Imai, Chair
NEC Electronics Corporation
Kanagawa, Japan

Olof Engstrom
Chalmers University of Technology
Goteborg, Sweden

Olivier Faynot
CEA Grenoble
Grenoble, France

Rusty Harris
Texas A&M University
College Station, TX

Seok-Hee Lee
Intel Corporation
Hillsboro, OR

Youichi Momiyama
Fujitsu Microelectronics Limited
Mie-ken, Japan

Ken Rim
IBM
Hopewell Junction, NY

Klaus Schruefer
Infineon Technologies AG
Neubiberg, Germany

Luca Selmi
University of Udine
Udine, Italy

Hyungcheol Shin
Seoul National University
Seoul, Korea

Mariko Takayanagi
Toshiba Corporation
Albany, NY

Tomonari Yamamoto
TSMC Hsinchu, Taiwan

Geoffrey Yeap
Qualcomm
San Diego, CA


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CHARACTERIZATION, RELIABILITY, AND YIELD COMMITTEE

Tanya Nigam, Chair
GlobalFoundaries
Sunnyvale, CA

Min Cao
TSMC
Hsinchu, Taiwan

Xavier Garros
CEA-LETI/Minatec
Grenoble, France

Norio Koike
Semiconductor Company
Panasonic Corporation
Kyoto, Japan

Srikanth Krishnan
Texas Instruments
Dallas, TX

Hiroshi Miki
Hitachi America
Yorktown Heights, NY

Alessandro Paccagnella
University of Padova
Padova, Italy

Sangwoo Pae
Intel
Hillsboro, OR

Ramgopal Rao
IIT Bombay
Mumbai, India

Elyse Rosenbaum
University of Illinois at Urbana-Champaign
Urbana, IL

Jurriaan Schmitz
University of Twente
Enschede, The Netherlands

Kiyoshi Takeuchi
NEC Electronics
Kanagawa, Japan

Zsolt Tokei
IMEC
Leuven, Belgium

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DISPLAYS, SENSORS AND MEMS COMMITTEE

Werner Weber, Chair
Infineon Technologies AG
Neubiberg, Germany

Yoshiharu Kudoh
Sony Corporation
Kanagawa, Japan

Farrokh Ayazi
Georgia Institute of Technology
Atlanta, GA

Sunil Bhave
Cornell University
Ithaca, NY

Karlheinz Bock
University of Berlin
Berlin, Germany

Karl Böhringer
University of Washington
Seattle, WA

Hiroaki Fujita
Eastman Kodak Company
Rochester, NY

Christofer Hierold
ETH-Zürich
Zürich, Switzerland

Torii Kazuyoshi
Hitachi Central Research Laboratory
Tokyo, Japan

Shey-Shi Lu
National Taiwan University
Taipei, Taiwan, ROC

Francois Roy
STMicroelectronics
Crolles Cedex, France

Chris van Hoof
Stichting Imec Nederland
Eindhoven, The Netherlands

Kwang-Seok Yun
Sogang University
Seoul, South Korea

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MEMORY TECHNOLOGY COMMITTEE

Norikatsu Takaura, Chair
Hitachi, Ltd.
Tokyo, Japan

Hideaki Aochi
Toshiba Corp.
Yokohama, Japan

Tsu-Ning Fang
Spansion
Sunnyvale, CA

Hyunsang Hwang
Gwangju Inst. of Sci. & Tech. (GIST)
Gwangju, Korea

Daniele Ielmini
Politecnico di Milano
Milan, Italy

Adrian Ionescu
Ecole Polytechnique Federale de Lausanne
Lausanne, Switzerland

Jong-Ho Lee
Kyungpook Nat’l Univ.
Daegu, Korea

Chenhsin Lien
National Tsing Hua University
Hsinchu, Taiwan

Rajeev Malik
IBM, Systems and Technology Group
Hopewell Junction, NY

Agostino Pirovano
Numonyx Italy S.r.l.
Agrate Brianza,Italy

Toshitsugu Sakamoto
NEC Corporation
Kanagawa, Japan

Klaus Schuegraf
SanDisk Corporation
Milpitas, CA

Jan Van Houdt
IMEC
Leuven, Belgium

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MODELING AND SIMULATION COMMITTEE

Phil Oldiges, Chair
IBM
Hopewell Junction, NY

Franck Arnaud
ST Microelectronics
Hopewell Junction, NY

Paulette Clancy
Cornell University
Ithaca, NY

Paolo Fantini
Numonyx
Agrate Brianza, Italy

Massimo Fischetti
University of Massachusetts
Amherst, MA

Tatsuya Kunikiyo
Renesas Technology Corp.
Hyogo, Japan

Victor Moroz
Synopsys
Mountain View, CA

Taiji Noda
Panasonic Corporation
Kyoto, Japan

Shinji Odanaka
Osaka University
Osaka Japan

Pierpaolo Palestri
University of Udine
Udine, Italy

Peter Pichler
Fraunhofer IISB
Erlangen, Germany

Ganesh Samudra
National Univ. of Singapore
Singapore, Singapore

Wei-Kai Shih
Intel Corporation
Hillsboro, OR

Klaus von Arnim
Infineon Technologies
Neubiberg, Germany

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PROCESS TECHNOLOGY COMMITTEE

Stefan De Gendt, Chair
IMEC
Leuven, Belgium

Weng Chang
TSMC
Taiwan, ROC

Xiaomeng Chen
IBM
Hopewell Junction, NY

Paul Ferreira
STMicroelectronics
Hopewell Junction, NY

Dan Gealy
Micron
Leuven, Belgium

Michael Hattendorf
Intel
Hillsboro, OR

Naoya Inoue
NECEL
Kanagawa, Japan

Paul Kohl
George Tech
Atlanta, GA

Kentaro Shibahara
Hiroshima University
Hiroshima, Japan

Kyoungsub Shin
Samsung
Gyeonggi-Do, Korea

Hsing-Huang Tseng
Texas State University
San Marcos, TX

Yoshinori Tsuchiya
Toshiba America Electronic Components, Inc.
Albany, NY

Bob Wallace
University of Texas, Dallas
Richardson, TX

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QUANTUM, POWER, AND COMPOUND SEMICONDUCTOR DEVICES

Patrick Fay, Chair
University of Notre Dame
Notre Dame, IN

Berinder Brar
Teledyne Scientific and Imaging
Thousand Oaks, CA

Suman Datta
Penn State University
University Park, PA

Sylvain Delage
Alcatel
Marcoussis, France

Frederic Gaillard
CEA/LITEN/DTNM
Grenoble, France

Kaoru Inoue
Pansonic Corporation
Kyoto, Japan

Toshihide Kikkawa
Fujitsu Laboratories, Ltd.
Kanagawa Japan

Kei May Lau
Hong Kong University of Science & Technology
Kowloon, Hong Kong

Rebecca Nikolic
Lawrence Livermore National Lab
Livermore, CA

Tomas Palacios
Massachusetts Institute of Technology
Cambridge, MA

Jan Sonsky
NXP Semiconductors
Leuven, Belgium

Hong Wang
Nanyang Technological University
Singapore

Hongning Yang
Freescale Semiconductor, Inc.
Tempe, AZ

Enrico Zanoni
Universita di Padova
Padova, Italy

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SOLID STATE AND NANOELECTRONIC DEVICES COMMITTEE

Sunae Seo, Chair
Samsung Advanced Institute of Technology
Gyeonggi-Do, Korea

Kerem Akarvardar
Stanford University
Stanford, CA

Zhihong Chen
IBM T.J. Watson Research Center
Yorktown Heights, NY

Ali Javey
University of California, Berkeley
Berkeley, CA

Atsuhiro Kinoshita
Toshiba Corp.
Yokohama, Japan

Franz Kreupl
SanDisk Corporation
Milpitas, CA

Max Lemme
Harvard University
Cambridge, MA

Chee-Wee Liu
National Taiwan University
Taipei, Taiwan, ROC

Yiannos Manoli
University of Freiburg
Freiburg, Germany

Andreas Schenk
ETH Zurich
Zurich, Switzerland

Ken Shepard
Columbia University
New York, NY

Kojiro Yagami
Sony Corporation
Atsugi, Japan


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