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2009 IEDM Technical ProgramSelect sessions below to view online. A pdf version of the advance program will be available by the end of September. Session 2: Process Technology - CMOS Junctions: Advanced Anneals and Metrology Session 3: CMOS Devices and Technology – Device Scaling and Variability Session 4: Modeling and Simulation - Memory and Transport Modeling Session 5: Memory Technology – PRAM and RRAM Session 6: Characterization, Reliability, and Yield – Hi-K Session 7: Quantum, Power, and Compound Semiconductors – Power Devices: Si, SiC, GaN Session 8: Displays, Sensors, and MEMS – TFT Technologies Session 9: Solid-State and Nanoelectronics Devices – Spin Devices and Nano-Electromechanical Devices Session 10: Emerging Technologies - Graphene Nanoelectronics Session 11: Memory Technology – RAM and Modeling of Memory Reliability Session 12: CMOS Devices and Technology – FinFET and Nanowire Devices Session 13: Quantum, Power, and Compound Semiconductors – III-V Logic Transistors with Advanced Gate Stack Session 14: Process Technology – Advanced 3D Technology and Processing Session 15: Displays, Sensors and MEMS – Organic Electronics Session 16: Characterization, Reliability and Yield – Product Reliability and ESD Session 17:Process Technology – High-k and Metal Gate Technology Luncheon PresentationSession 18: 2009 IEDM Special Session: Confluence of Technology and Design: Design Issues on 32/22nm and Beyond Session 19: CMOS Devices and Technology – Channel Transport in Advanced Si and Ge Devices Session 20: Quantum, Power and Compound Semiconductors – III-V HEMT Device Scaling Session 21: Modeling and Simulation – CMOS Process and Optimization Session 22: Displays, Sensors and MEMS – Heterogeneous Integration for Energy Harvesting and Photonics Session 23: State and Nanoelectronic Devices – Silicon Photonics, Carbon Devices and Integration Session 24: 2009 IEDM Evening Panel Discussion Session 25: 2009 IEDM Evening Panel Discussion Session 26: Displays, Sensors and MEMS – Medical and Bioelectronics Session 27: Memory Technology – 3D Memory: Non-volatile Memory Architectures Session 28: CMOS Devices and Technology – Advanced High-K Metal Gate SoC and High Performance CMOS Platforms Session 29: Process Technology – Si Channel Engineering and Ge Technologies Session 30: Modeling and Simulation – Noise and Fluctuations Session 31: Characterization, Reliability and Yield – BTI and Memory Session 32: Characterization, Reliability and Yield – Random Telegraph Noise Session 33: Displays, Sensors and MEMS – Micro-Resonators and RF MEMS Session 34: Memory Technology – Flash Memory Session 35: Quantum, Power and Compound Semiconductors – CMOS Compatible, High Mobility III-V Devices Session 36: Process Technology – Advanced Interconnect Technologies for CMOS Applications Session 37: Modeling and Simulation – Emerging Devices Session 38: Solid-State and Nanoelectronic Devices – Devices and Circuits Based on Nanowires and Solid-Electrolyte Switches |
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