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Monday, December 5, 9:00 a.m.
International Ballroom Center

Welcome and Awards
General Chair: Jon Candelaria, Motorola

Invited Papers
Technical Program Chair: Kaizad Mistry, Intel

1.1 More Than Moore: Micromachined Products Enable New Applications and Open New Markets, Benedetto Vigna, ST Microelectronics

Micro-Electromechanical Systems are not driven by the lithography scaling law, like memories and microprocessors. New manufacturing dimensions become relevant for the commercialization and the success of MEMS products and in the last years the rate of success of MEMS products increased tremendously. Bulk Acoustic Wave filters, 3-axis accelerometers for consumers markets, silicon Microphone and Micro-mirrors for projectors took off recently enabling new applications and enhancing the features of the current products. MEMS can substitute current products offering the advantage of lower size, greater reliability and lower power consumption, but can enable totally new applications like the data protection in Hard Disk Drive based devices. All the technical and business experts believe that after the "Nomadic Era" Wireless Sensor Networks and Domestic Robots will represent the next big commercial wave for semiconductors. And MEMS will be one of the key enabler products for these new markets and applications. The talk will give a picture of the current and future prospects of MEMS technologies, products and applications.

1.2 Scaling, Power and the Future of CMOS, Mark Horowitz, Stanford University and Rambus, Inc.

In the mid 1980's the power growth that accompanied scaling forced the industry to focus on CMOS technology, and leave nMOS and bipolars for niche applications. Now 20 years later, CMOS technology is facing power issues of its own. After first reviewing the "cause" of the problem, it will become clear that there are not easy solutions this time — no new technology or simple system/circuit change will rescue us. Power, and not number of devices is now the primary limiter of chip performance, and the need to create power efficient designs is changing how we do design. This talk will review power optimized design methods and shows how power is strongly tied to performance and that variability aversely effects power efficiency. Projecting forward, it shows that unless die size shrinks, in future technologies most of the devices will need to be idle most of the time which has strong ramifications for the both the underlying device and system design.

1.3 Past and Future of Information Displays, Kouji Suzuki, Toshiba Corp. and SED, Inc.

A concise summary will be given of the history of display technology and new display devices coming in the near future. CRT (Cathode Ray Tube) display including CRT projection display was for a long time the only device capable of exhibiting moving picture images applicable to TV receivers. To improve bulky and heavy structure of CRT, FPDs (flat panel displays) have been developed and available in the market nowadays. Typical FPDs, namely LCD (Liquid Crystal Display) and PDP (Plasma Display Panel), have been applied to TV sets. Especially, LCD has many application fields, because of its size variation and high-resolution capability. However, picture quality of current FPD are still inferior to that of the CRT, and new types of flat panel display with high picture quality under development will come into the market in the near future. Some examples are OLED (Organic Light Emitting Diode) and FED (Field Emission Display). The presentation will also introduce key technologies which realize those displays.