2010 IITC Organizing Committee

2010 IEEE International Interconnect Technology Conference

2010 IITC Organizing Committee

EXECUTIVE COMMITTEE

Conference General Co-chairs:
Mike Shapiro, IBM
Rudi Cartuyvels, IMEC
Shin-puu Jeng, TSMC

OFFICERS AND MEMBERS

North America Program Chair: John Iacoponi, AMD
North America Program Co-chair: Dorel Toma, Tokyo Electron U.S. Holdings
Asia Program Chair: Takeshi Furusawa, Renesas Technology Corp.
Asia Program Co-chair: Hyun-Chul Sohn, Yonsei University
Europe Program Chair: Ehrenfried Zschech, AMD
Europe Program Co-chair: Vincent Arnal, STMicroelectronics
Publicity Chair: Michael Armacost, Applied Materials
Publicity Co-Chairs: Andreas Klipp, BASF Electronic Materials and Hiroshi Toyoda, Toshiba Corp.
Short Course Chair: Nagaraj NS, Texas Instruments
Short Course Co-chairs: Didier Louis, CEA/LETI and Climbing Huang, UMC
Treasurer: John Iacoponi, AMD
Supplier Relations: Bill Brennan, Spansion
Supplier Relations: Didier Louis, CEA/LETI
Supplier Relations: Osamu Yamazaki, Sharp Corp.

PROGRAM COMMITTEE

North America

Chair: John Iacoponi, AMD
Co-Chair: Dorel Toma, Tokyo Electron U.S. Holdings
Michael Armacost, Applied Materials
Sridhar Balakrishnan, Intel Corp.
Paul Besser, Unity Semiconductor
Bill Brennan, Spansion
Mike Gallagher, Rohm & Haas
Pawan Kapur, Solexel
Scott List, SRC
James Lu, RPI
Andrew McKerrow, Novellus
Azad Naeemi, Georgia Institute of Technology
Nagaraj NS, Texas Instruments
Hector Sanchez, Freescale Semiconductor
Deepak Sekar, SanDisk Corp.
David Young, Skyworks Solutions

Asia

Chair: Takeshi Furusawa, Renesas Technology Corp.
Co-Chair:Hyun-Chul Sohn, Yonsei University
Chee Lip Gan, Nanyang Technological University
Toshiaki Hasegawa, Sony Corp.
Climbing Huang, UMC
Kuniko Kikuta, NEC Electronics
Noh-Jung Kwak, Hynix Semiconductor
Jeong-gun Lee, MagnaChip Semiconductor
Nae-In Lee, Samsung Electronics Co., Ltd.
Chien-Neng Liao, National Tsing-Hua University
Shinichi Ogawa, SELETE
Hyn-Chul Sohn, Yonsei University
Kenichi Takeda, Hitachi Ltd.
Tetsu Tanaka, Tohoku University
Hiroshi Toyoda, Toshiba Corp.
Hirofumi Watatani, Fujitsu Micorelectronics Ltd.
Osamu Yamazaki, Sharp Corp.

Europe

Chair: Ehrenfried Zschech, AMD
Co-Chair: Vincent Arnal, STMicroelectronics
Hans-Joachim Barth, Infineon Technologies
Johann Bartha, Technical University of Dresden
Myriam Buchbinder, Tower Semiconductor
Andreas Klipp, BASF Electronic Material
Didier Louis, CEA/LETI
John MacNeil, Aviza Technology
Ivo Raaijmakers, ASM International nv
Mikko Ritala, University of Helsinki
Joost Waeterloos, The Dow Chemical Company

Past General Co-chairs:
1998-2000: Robert Havemann, Novellus, Karen Maex, IMEC, Takamaro Kikkawa, Hiroshima University
2001: Rich Liu, Macronix, Genda Hu, TSMC, Hans-Joachim Barth, Infineon Technologies
2002: Robert Geffken, IBM, Nobuyoshi Kobayashi, ASM Japan K.K. and Mehdi Moussavi, AMAT
2003: Krishna Saraswat, Stanford University, Nobuo Hayasaka, Toshiba Corporation and Johann Bartha, Technical University of Dresden
2004: Betsy Weitzman, International SEMATECH, Douglas C.H. Yu, TSMC and Joaquin Torres, STMicroelectronics
2005: Duane Boning, Massachusetts Institute of Technology, Shinichi Ogawa, SELETE, Dirk Gravesteijn, Philips Research
2006: Christopher Case, The Linde Group, Jeong-gun Lee, MagnaChip Semiconductor Inc., Didier Louis, CEA/LETI
2007: Harold Hosack, SRC, Calvin Hsueh, TSMC, Joost Waeterloos, The Dow Chemical Company
2008: Gary W. Ray, Intel Corp., Kuniko Kikuta, NEC Electronics, and Ivo Raaijmakers, ASM International
2009: Young-Chang Joo, Seoul National University, J.D. Luttmer, DR-Infrared Technologies, John MacNeil, Aviza Technology