2008 IITC Organizing Committee

2008 IEEE International Interconnect Technology Conference

2008 IITC Organizing Committee

EXECUTIVE COMMITTEE

Conference General Co-chairs:
Gary Ray, Intel Corp.
Kuniko Kikuta, NEC Electronics Corp.
Ivo Raaijimakers, ASM International, nv

OFFICERS AND MEMBERS

North America Program Chair: J.D. Luttmer, University of North Texas
North America Program Co-chair: Mike Shapiro, IBM
Asia Program Chair: Young-Chang Joo, Seoul National University
Asia Program Co-chair: Shin-Puu Jeng, TSMC
Europe Program Chair: John MacNeil, Aviza Technology
Europe Program Co-chair:Rudi Cartuyvels, IMEC
Publicity Chair: Mike Shapiro, IBM
Short Course Chair: Rudi Cartuyvels, IMEC
Short Course Co-chair: Stephen Luce, IBM
Treasurer: John Iacoponi, AMD
Supplier Relations: Robin Cheung, Unity Semiconductor Corp.
Supplier Relations: Didier Louis, CEA/LETI

PROGRAM COMMITTEE

North America

Chair: J.D. Luttmer, University of North Texas
Co-Chair: Mike Shapiro, IBM
Michael Armacost, Applied Materials
Maureen Brongo, Skyworks Solutions
Robin Cheung, Unity Semiconductor Corp.
Girish Dixit, Novellus
John Iacoponi, AMD
Pawan Kapur, Stanford University
Warren Lai, Alcatel/Lucent
Scott List, SRC
Toh-Ming Lu, RPI
Stephen Luce, IBM
James Meindl, Georgia Institute of Technology
Hector Sanchez, Freescale Semiconductor
Dorel Toma, Tokyo Electron U.S. Holdings

Asia

Chair: Young-Chang Joo, Seoul National University
Co-Chair: Shin-Puu Jeng, TSMC
Takeshi Furusawa, Renesas Technology Corp.
Toshiaki Hasegawa, Sony Corp.
Climbing Huang, UMC
Makiko Kageyama, Oki Electric Industry Co,
Noh-Jung Kwak, Hynix Semiconductor
Jeong-gun Lee, MagnaChip Semiconductor
Nae-In Lee, Samsung Electronics Co., Ltd.
Tomoji Nakamura, Fujitsu Labs., Ltd.
Shinichi Ogawa, SELETE
Tatsuyuki Saito, Hitachi, Ltd.
Hyun-Chul Sohn, Yonsei University
Hiroshi Toyoda, Toshiba Corp.
Osamu Yamazaki, Sharp Corp.
Tri-Rung Yew, National Tsing-Hua University

Europe

Chair: John MacNeil, Aviza Technology
Co-Chair:Rudi Cartuyvels, IMEC
Hans-Joachim Barth, Infineon Technologies
Johann Bartha, Technical University of Dresden
Myriam Buchbinder, Tower Semiconductor
Didier Louis, CEA/LETI
Mikko Ritala, University of Helsinki
Joaquin Torres, STMicroelectronics
Joost Waeterloos, The Dow Chemical Company
Alexandra Wirth, BASF Electronic Material

Past General Co-chairs:
1998-2000: Robert Havemann, Novellus, Karen Maex, IMEC, Takamaro Kikkawa, Hiroshima University
2001: Rich Liu, Macronix, Genda Hu, TSMC, Hans-Joachim Barth, Infineon Technologies
2002: Robert Geffken, IBM, Nobuyoshi Kobayashi, ASM Japan K.K. and Mehdi Moussavi, AMAT
2003: Krishna Saraswat, Stanford University, Nobuo Hayasaka, Toshiba Corporation and Johann Bartha, Technical University of Dresden
2004: Betsy Weitzman, International SEMATECH, Douglas C.H. Yu, TSMC and Joaquin Torres, STMicroelectronics
2005: Duane Boning, Massachusetts Institute of Technology, Shinichi Ogawa, Matsushita Electric Ind. Co., Ltd, Dirk Gravesteijn, Philips Research
2006: Christopher Case, BOC Edwards, Jeong-gun Lee, MagnaChip Semiconductor Inc., Didier Louis, CEA/LETI
2007: Harold Hosack, SRC, Calvin Hsueh, TSMC, Joost Waeterloos, The Dow Chemical Company