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General InformationFor the first time, the 2009 IITC will be held in an international location. The twelfth annual conference will be held at the Royton Sapporo Hotel in Sapporo, Hokkaido, Japan , June 1 - 3, 2009. A Short Course will precede the conference on May 31. The IITC is sponsored by the IEEE Electron Devices Society and the Japan Society of Applied Physics as a premier conference for interconnect technology. The IITC provides a unique forum for professionals and researchers in semiconductor processing, advanced materials, equipment development, and interconnect systems to present and discuss exciting new science and technology.
The conference provides several venues for learning and professional interaction. The ever-popular Short Course addressing advanced interconnect process, design and reliability issues will once again be offered on the day preceding the conference (May 31), and participation is strongly encouraged by those wishing to keep abreast of the latest interconnect technology.
The cost and performance of ULSI circuits strongly depend on the capability and productivity of interconnect materials and processing equipment. In recognition of this critical role, supplier exhibits and seminars are included as an integral part of the IITC technical program and will be held on the first and second days of the conference. The exhibits and seminars offer additional learning and networking oppportunities, and provide alternative forums to address specific technological challenges.
Oral presentations and poster papers offered during the conference span a broad range of interconnect technology topics which include: Materials and Unit Processes For additional information or general inquiries contact: IITC |
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© 2008-2009 IEEE all rights reserved. Photo: Bart Edson |
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