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2009 Technical Program
SESSION 1: PLENARY
SESSION 2: PROCESS INTEGRATION I
SESSION 3: INTERCONNECT SYSTEMS
SESSION 4: NOVEL MATERIALS AND CONCEPTS
SESSION 5: TSV/3D PROCESSES & INTEGRATION
SESSION 6: METROLOGY/PROCESS CONTROL
SESSION 7: POSTER SESSION (ROYTON HALL A/B)
SESSION 8: RELIABILITY
SESSION 9: MATERIALS AND UNIT PROCESSES I
SESSION 10: PACKAGING
SESSION 11: METROLOGY & PROCESS CONTROL II
SESSION 12: MATERIALS AND UNIT PROCESSES II
SESSION 13:PROCESS INTEGRATION II
© 2008-2009 IEEE all rights reserved. Photo: Bart Edson